 |
MTP 12CH×3 to 36-Channel Fiber Array Assembly – 3×12CH MTP Connectors to 36CH V-Groove FAU, Low Insertion Loss, for 1.6T Optical Transceivers & Co-Packaged Optics (CPO)
Product Details:
| Place of Origin: | ShenZhen & ZhongShan,China |
| Brand Name: | DF/OEM/Nuetral |
| Certification: | CE/ROHS/CPR EN50575/ISO9001 /ISO14001 |
| Model Number: | MTP 12CH*3-FA 36CH |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | can be negotiated |
| Packaging Details: | Carton |
| Delivery Time: | 5-9 working days depend on QTY |
| Payment Terms: | T/T,Western Union,Paypal |
| Supply Ability: | 1000 PCS/Days |
|
Detail Information |
|||
| Highlight: | MTP 12CH fiber array assembly,36-channel V-groove FAU,low insertion loss MTP connectors |
||
|---|---|---|---|
Product Description
MTP 12CH×3 to 36-Channel Fiber Array Assembly
3×12CH MTP Connectors to 36CH V-Groove FAU, Low Insertion Loss, for 1.6T Optical Transceivers & Co-Packaged Optics (CPO)
Product Overview
The MTP 12CH×3 to 36-Channel Fiber Array Assembly is a high-density optical interconnect component designed for 1.6T optical transceivers, co-packaged optics (CPO), and silicon photonic packaging. It integrates three 12‑fiber MTP/MPO connectors as inputs and routes all 36 fibers to a single high‑precision 36‑channel V‑groove fiber array unit (FAU) output.
This configuration solves a critical packaging challenge: external interfaces require multiple MTP connectors, but the photonic integrated circuit (PIC) or PD array requires a single, large‑width fiber array for one‑time alignment. By consolidating three separate 12‑channel inputs into one 36‑channel output array, this component enables single‑step passive alignment between the fiber array and the chip, significantly reducing assembly complexity.
Key Features
- High-density optical interconnect solution
- Three 12-fiber MTP/MPO input connectors
- Single 36-channel V-groove fiber array output
- Low insertion loss performance
- Precision alignment for silicon photonic packaging
- Designed for volume manufacturing
Applications
- 1.6T optical transceivers (QSFP‑DD / OSFP)
- Co‑packaged optics (CPO) and optical I/O
- High‑density silicon photonic packaging
- Optical circuit switches (OCS)
- High‑performance computing (HPC) optical interconnects
- Data center high‑density parallel links
Product Advantages
This component is designed for volume manufacturing of next‑generation 1.6T optical modules, where every micron of space and every second of assembly time matters. By integrating three MTP inputs into a single, pre‑aligned fiber array, it reduces assembly steps, improves alignment accuracy, and accelerates time‑to‑market.
Why Choose TAKFLY
26 Years of Manufacturing Experience in Fiber Optic Products
Manufacturing Capabilities
- Experienced Assembly Team: More than 80 assembly workers with 6+ years of experience
- Strong R&D Capability: More than 10 R&D engineers
- Advanced Production Equipment: 16 sets of German imported injection machines and 16 production lines
- Comprehensive Testing Facilities: More than 30 sets of testing instruments including OTDR, ILD, VFL, RL, IL, tension strength testers, crush resistance testers, power meter testers, and light checkers
- OEM Branding Accepted: Custom logo/branding available
Quality Control Process
- Incoming inspection: Spot check of raw materials before production
- In-process inspection: Full inspection at every individual process completion
- Pre-packaging inspection: Full inspection of finished products before packing
- Pre-shipping inspection: Spot check before shipping
Industry Participation
Source Electronics Exhibition, OFC, FOCC, ConnecAsia, NFTCOM, AFRICACOM, SMART ICT, Contelem, China
Delivery Information
- Samples: 1-3 working days
- Mass production orders: 3-7 working days
- Packaging: Plastic bag, carton, and pallet options available according to your requirements
Ratings & Review
Want to Know more details about this product
Overall Rating
Rating Snapshot
The following is the distribution of all ratingsAll Reviews